- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 24/00 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
Patent holdings for IPC class H01R 24/00
Total number of patents in this class: 1686
10-year publication summary
|
129
|
138
|
138
|
104
|
78
|
66
|
62
|
56
|
55
|
18
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Hon Hai Precision Industry Co., Ltd. | 4157 |
84 |
| Foxconn Interconnect Technology Limited | 1034 |
78 |
| Panduit Corp. | 1007 |
52 |
| CommScope, Inc. of North Carolina | 647 |
46 |
| Molex, LLC | 1792 |
46 |
| Japan Aviation Electronics Industry, Limited | 1585 |
40 |
| CommScope Technologies LLC | 4937 |
38 |
| Advanced Connectek Inc. | 338 |
34 |
| TE Connectivity Solutions GmbH | 2580 |
34 |
| Sumitomo Wiring Systems, Ltd. | 9367 |
32 |
| Molex Incorporated | 609 |
22 |
| Lotes Co., Ltd. | 346 |
22 |
| Tyco Electronics Japan G.K. | 382 |
21 |
| CommScope EMEA Limited | 512 |
21 |
| Sumitomo Electric Industries, Ltd. | 14131 |
20 |
| Yazaki Corporation | 6282 |
20 |
| AutoNetworks Technologies, Ltd. | 5809 |
20 |
| Apple Inc. | 50209 |
17 |
| Leviton Manufacturing Co., Inc. | 844 |
16 |
| Huawei Technologies Co., Ltd. | 100781 |
14 |
| Other owners | 1009 |